built on our cmos/mems technology platform (originally launched in 2002), the sisonic™ silicon-based microphone series is entering its fourth generation of development, with product shipments exceeding 5 billion units to date. the proven and evolving design series continues to support high-performance, high-density innovation in such applications as cell phones, digital still cameras, portable music players, and other portable electronic devices.
design variables include ever-smaller sizes, lower profiles and mounting options, increased output capacities, and new digital audio options that eliminate analog noise. for manufacturers, surface mount designs eliminate off-line subassembly production costs. customized designs are supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment during in-line surface mount manufacturing.
the microphones can also be integrated with our patented intellisonic™ software and special porting designs to provide a precisely customized sound.
features
new maxrf models eliminate gsm/tdma burst noise and provide wide-band rf noise suppression
ultramini footprint - less than 11.5mm
slim ultramini footprint - less than 8.5mm
digital mics eliminate analog noise
integrated designs with differential or switchable gain
bottom port for thinnest ever designs
multiple performance modes (sleep, low-power, standard mode) optimize voice-trigger applications by entering a low-power high-snr sensing mode
